Stress Intensity Factor Analysis of an Interface Crack between Dissimilar Materials under Thermal Stress Condition by Virtual Crack Extension Method.
نویسندگان
چکیده
منابع مشابه
Crack deflection at an interface between dissimilar piezoelectric materials
The problem of crack deflection in bimaterial systems is considered in this paper. The material combinations may be of piezoelectric-piezoelectric, or one is piezoelectric and the other is not. Based on the Stroh formulation for anisotropic material, Green’s functions for various bimaterial combinations are presented within the framework of two-dimensional electroelasticity, allowing the crack ...
متن کاملAccurate Determination of Stress Intensity Factor for Interface Crack by Finite Element Method
This paper presents the simple method to determine the complex stress intensity factor of interface crack problem by the finite element method. The proportional method is extended to the interface crack problem. In the present method, the stress values at the crack tip calculated by FEM are used and the stress intensity factors of interface crack are evaluated from the ratio of stress values be...
متن کاملCrack propagation and fracture in silicon wafers under thermal stress
The behaviour of microcracks in silicon during thermal annealing has been studied using in situ X-ray diffraction imaging. Initial cracks are produced with an indenter at the edge of a conventional Si wafer, which was heated under temperature gradients to produce thermal stress. At temperatures where Si is still in the brittle regime, the strain may accumulate if a microcrack is pinned. If a cr...
متن کاملCement-Implant Interface Fracture Failure by Crack Initiation Due to Interface Cavity Stress Concentration
Nowadays total joint replacements are widely used in the world, so in average 800,000 joint surgeries are done yearly only in Europe and North America. However implant loosening is and remains as the major issue of all implant failures and therefore causes revision surgery procedures. Studies and experiments have identified poor fixation of implants most likely is the main cause of long term im...
متن کاملStress Analysis at a Bi-Material Interface Crack-tip
The optical methods of Caustics, Photoelasticity and Isopachics for the evaluation of the stress intensity factors and the distribution of the principal stresses at a bi-material interface crack-tip, were proposed. The caustics, isochromatic and isopachic fringes are developed from the stress field which results from a stress function X(r, ). When the crack-tip, which is perpendicular to interf...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
سال: 1997
ISSN: 0387-5008,1884-8338
DOI: 10.1299/kikaia.63.1377